Modern Ansys Design Language elevates the user experience (UX) to create a new user interface (UI) paradigm across the Ansys (ANSS) multiphysics portfolio and increases accessibility Native Ansys ...
PITTSBURGH, July 23, 2024 /PRNewswire/ -- Ansys (NASDAQ: ANSS) 2024 R2 redefines the boundaries of product design by enabling customers to move beyond the limits of single-physics simulation to gain ...
Ansys (ANSS) electro-thermal analysis tools address novel physics requirements for signoff verification of multi-chip HPC, graphics, and AI applications / Key Highlights Ansys collaboration to expand ...
AI-based workflows aid advanced node designs, ensuring design and system technology co-optimization for HPC and AI applications / Key Highlights TSMC and Ansys advance AI-assisted workflows to support ...
Latest release fuels collaboration and digital transformation by connecting workflows, integrating AI, and optimizing complex design tasks / Key Highlights Unified Ansys technology reduces the need ...
PITTSBURGH, Feb. 22, 2024 /PRNewswire/ -- Ansys (NASDAQ: ANSS) and Intel Foundry collaborated to provide multiphysics signoff solutions for Intel's innovative 2.5D chip assembly technology, which uses ...