First order process modeling can help tremendously with process setup and integration challenges that occur in a semiconductor fabrication flow, by visualizing process variation problems “virtually” ...

As silicon photonics manufacturing gains momentum with additional foundry and 300mm offerings, process variation issues are coming to light. Variability in silicon processing affects the waveguide ...

Use of machine learning and feed-forward neural networks presents a new and exciting opportunity to develop high-accuracy CMP models of complex, advanced deposition processes. Machine learning (ML), ...

In the past decade, chemical-mechanical polishing (CMP) has emerged as the predominant planarization technique for shallow trench isolation (STI) and back end of the line (BEOL) metallization. To ...

Chemical mechanical polishing (CMP) – also known as planarization – has long been the most commonly employed technique for smoothing and flattening wafer surfaces during the fabrication of ...